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Part Details for 10AX066H4F34E3SG by Intel Corporation
Results Overview of 10AX066H4F34E3SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Communication and Networking
10AX066H4F34E3SG Information
10AX066H4F34E3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX066H4F34E3SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 468 |
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RFQ |
Part Details for 10AX066H4F34E3SG
10AX066H4F34E3SG CAD Models
10AX066H4F34E3SG Part Data Attributes
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10AX066H4F34E3SG
Intel Corporation
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Datasheet
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10AX066H4F34E3SG
Intel Corporation
Field Programmable Gate Array, 660000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Number of CLBs | 25168 | |
| Number of Inputs | 492 | |
| Number of Logic Cells | 660000 | |
| Number of Outputs | 492 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 25168 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |
10AX066H4F34E3SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX066H4F34E3SG FPGA is approximately 12W, depending on the operating frequency and usage.
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Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
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To optimize your design for area and performance, Intel recommends using the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, as well as using the Intel FPGA Optimization Guide to apply optimization techniques.
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To ensure signal integrity in your high-speed design, Intel recommends following the guidelines outlined in the Intel FPGA Signal Integrity User Guide. This includes using the Intel Quartus Prime software to analyze and optimize your design for signal integrity, as well as using techniques such as channel equalization and pre-emphasis.
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Intel recommends following the PCB design guidelines outlined in the Intel FPGA PCB Design Guidelines document. This includes guidelines for PCB layout, signal routing, and power distribution.