Part Details for 10AX057H3F34I2SG by Intel Corporation
Results Overview of 10AX057H3F34I2SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX057H3F34I2SG Information
10AX057H3F34I2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX057H3F34I2SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 6 |
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RFQ |
Part Details for 10AX057H3F34I2SG
10AX057H3F34I2SG CAD Models
10AX057H3F34I2SG Part Data Attributes
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10AX057H3F34I2SG
Intel Corporation
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Datasheet
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10AX057H3F34I2SG
Intel Corporation
Field Programmable Gate Array, 570000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Number of CLBs | 21708 | |
| Number of Inputs | 492 | |
| Number of Logic Cells | 570000 | |
| Number of Outputs | 492 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 21708 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |
10AX057H3F34I2SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX057H3F34I2SG FPGA is approximately 12W, depending on the operating frequency and usage.
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Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
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To optimize your design for area and performance, use the Intel Quartus Prime software to analyze and optimize your design. Utilize the software's built-in optimization tools, such as the Design Space Explorer (DSE) and the Hyper-Aptimize feature, to explore different design implementations and find the optimal solution.
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To ensure signal integrity in your high-speed design, follow Intel's signal integrity guidelines, which include using differential signaling, minimizing trace lengths, and using termination resistors. Additionally, use the Intel Quartus Prime software to analyze and optimize your design for signal integrity.
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Intel recommends a 4-layer or 6-layer PCB stackup with a minimum of two power planes and two ground planes. The PCB layout should also follow Intel's guidelines for signal routing, decoupling, and thermal management, as outlined in the Intel FPGA PCB Design Guidelines document.