Part Details for 10AX027H4F35E3SG by Intel Corporation
Results Overview of 10AX027H4F35E3SG by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
10AX027H4F35E3SG Information
10AX027H4F35E3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AX027H4F35E3SG
10AX027H4F35E3SG CAD Models
10AX027H4F35E3SG Part Data Attributes
|
|
10AX027H4F35E3SG
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
10AX027H4F35E3SG
Intel Corporation
Field Programmable Gate Array, 270000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Number of CLBs | 10162 | |
| Number of Inputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of Outputs | 384 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 10162 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |
10AX027H4F35E3SG Frequently Asked Questions (FAQ)
-
Intel provides a PCB design guide for the Arria 10 SoC family, which includes the 10AX027H4F35E3SG. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. It also provides guidelines for signal routing, decoupling, and thermal management.
-
Intel provides a PowerPlay Early Power Estimator (EPE) tool that allows you to estimate power consumption based on your design's specific requirements. You can also use the Quartus II software to analyze and optimize power consumption during the design process.
-
The 10AX027H4F35E3SG has a maximum junction temperature of 100°C. Intel recommends using a heat sink or thermal solution that can dissipate up to 15W of power. You should also ensure good airflow and thermal conduction in your system design.
-
Intel recommends using a reliable configuration device, such as a flash memory or an external memory interface, to store the FPGA's configuration data. You should also ensure that the power supply is stable and meets the FPGA's power requirements during configuration and boot-up.
-
The 10AX027H4F35E3SG is a commercial-grade FPGA and is not designed for radiation-hardened or high-reliability applications. However, Intel provides environmental testing data, such as temperature and humidity testing, in the datasheet. You should consult with Intel or a qualified reliability expert to determine the FPGA's suitability for your specific application.