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Part Details for 10AX027E4F29I3SG by Intel Corporation
Results Overview of 10AX027E4F29I3SG by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX027E4F29I3SG Information
10AX027E4F29I3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AX027E4F29I3SG
10AX027E4F29I3SG CAD Models
10AX027E4F29I3SG Part Data Attributes
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10AX027E4F29I3SG
Intel Corporation
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Datasheet
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10AX027E4F29I3SG
Intel Corporation
Field Programmable Gate Array, 270000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B780 | |
| Length | 29 mm | |
| Number of CLBs | 10162 | |
| Number of Inputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of Outputs | 360 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 10162 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 29 mm |
10AX027E4F29I3SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX027E4F29I3SG is approximately 2.5W, but this can vary depending on the specific design and usage.
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To implement a DDR3 memory interface on the 10AX027E4F29I3SG, you need to use the FPGA's external memory interface (EMIF) and follow the guidelines provided in the Intel FPGA Memory Interface Handbook.
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Yes, the 10AX027E4F29I3SG supports high-speed serial interfaces like PCIe and SATA, and you can use the FPGA's transceivers to implement these interfaces.
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To optimize timing closure for your design on the 10AX027E4F29I3SG, you should use the Intel Quartus Prime software to analyze and optimize the timing of your design, and also consider using techniques like pipelining and retiming.
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Yes, the 10AX027E4F29I3SG has built-in cryptographic primitives and can be used for cryptographic applications, but you need to ensure that your design meets the relevant security standards and regulations.