Part Details for 10AX027E3F27I2SG by Intel Corporation
Results Overview of 10AX027E3F27I2SG by Intel Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX027E3F27I2SG Information
10AX027E3F27I2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AX027E3F27I2SG
10AX027E3F27I2SG CAD Models
10AX027E3F27I2SG Part Data Attributes
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10AX027E3F27I2SG
Intel Corporation
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Datasheet
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10AX027E3F27I2SG
Intel Corporation
Field Programmable Gate Array, 270000-Cell, CMOS, PBGA672, 27 X 27 MM, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 27 mm | |
| Number of CLBs | 10162 | |
| Number of Inputs | 240 | |
| Number of Logic Cells | 270000 | |
| Number of Outputs | 240 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 10162 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |
10AX027E3F27I2SG Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for the 10AX027E3F27I2SG, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, Intel suggests using a high-speed PCB material with a dielectric constant of 3.5-4.5.
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Intel recommends a power supply design with multiple voltage rails, including 1.0V, 1.2V, and 3.3V. A minimum of 10uF decoupling capacitance per power pin is recommended, with a total capacitance of 100uF or more per rail. Additionally, Intel suggests using a power supply with low output impedance and high current capability.
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The 10AX027E3F27I2SG has a maximum junction temperature of 100°C. Intel recommends using a heat sink with a thermal interface material (TIM) and a thermal resistance of 0.5°C/W or less. Additionally, Intel suggests using a fan or other cooling solution to maintain a maximum ambient temperature of 40°C.
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Intel recommends using a reliable configuration source, such as a flash memory device or a remote update mechanism. Additionally, Intel suggests implementing a robust boot-up sequence, including power-on reset, clock initialization, and configuration loading.
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Intel recommends following good EMI/EMC design practices, including using shielding, filtering, and grounding techniques. Additionally, Intel suggests using a PCB design with a solid ground plane and minimizing signal loop areas to reduce EMI emissions.