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Part Details for 10AX016E4F27E3SG by Intel Corporation
Results Overview of 10AX016E4F27E3SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX016E4F27E3SG Information
10AX016E4F27E3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX016E4F27E3SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 29 |
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RFQ |
Part Details for 10AX016E4F27E3SG
10AX016E4F27E3SG CAD Models
10AX016E4F27E3SG Part Data Attributes
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10AX016E4F27E3SG
Intel Corporation
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Datasheet
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10AX016E4F27E3SG
Intel Corporation
Field Programmable Gate Array, 160000-Cell, CMOS, PBGA672, 27 X 27 MM, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 27 mm | |
| Number of CLBs | 6151 | |
| Number of Inputs | 240 | |
| Number of Logic Cells | 160000 | |
| Number of Outputs | 240 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 6151 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |
10AX016E4F27E3SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX016E4F27E3SG is approximately 2.5W, but this can vary depending on the specific design and usage.
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Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
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To optimize your design, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize For' feature, which allows you to target specific design goals such as area, speed, or power. Additionally, consider using Intel's IP cores and optimized design examples to reduce area and improve performance.
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To ensure reliable data transmission, follow Intel's guidelines for transceiver usage, including using the correct transceiver settings, implementing proper channel bonding and lane alignment, and using Intel's built-in transceiver calibration and adaptation features.
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To manage thermal performance, ensure good airflow around the device, use a heat sink or thermal interface material, and follow Intel's guidelines for thermal design and power management. Additionally, consider using Intel's thermal analysis tools to simulate and optimize thermal performance.