Part Details for 10AX016E3F29I2SG by Intel Corporation
Results Overview of 10AX016E3F29I2SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
10AX016E3F29I2SG Information
10AX016E3F29I2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX016E3F29I2SG
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Vyrian | Programmable ICs | 3 |
|
RFQ |
Part Details for 10AX016E3F29I2SG
10AX016E3F29I2SG CAD Models
10AX016E3F29I2SG Part Data Attributes
|
10AX016E3F29I2SG
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
10AX016E3F29I2SG
Intel Corporation
Field Programmable Gate Array, 160000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
JESD-30 Code | S-PBGA-B780 | |
Length | 29 mm | |
Number of CLBs | 6151 | |
Number of Inputs | 288 | |
Number of Logic Cells | 160000 | |
Number of Outputs | 288 | |
Number of Terminals | 780 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 6151 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.35 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Technology | TSMC | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 29 mm |
10AX016E3F29I2SG Frequently Asked Questions (FAQ)
-
The maximum power consumption of the 10AX016E3F29I2SG is approximately 2.5W, but this can vary depending on the specific design and usage.
-
To implement a CDC in the 10AX016E3F29I2SG, you can use the Intel FPGA IP Catalog to generate a CDC module, or use a third-party IP core. You can also use the FPGA's built-in clock domain crossing features, such as the Clock Domain Crossing (CDC) IP core.
-
The maximum frequency of the 10AX016E3F29I2SG is approximately 500 MHz, but this can vary depending on the specific design and usage.
-
To optimize the 10AX016E3F29I2SG for low power consumption, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Intel FPGA Power Analyzer tool to analyze and optimize power consumption.
-
The 10AX016E3F29I2SG has a total of 16,020 logic elements (LEs) available.