Part Details for 10AS027E3F29I2SG by Intel Corporation
Results Overview of 10AS027E3F29I2SG by Intel Corporation
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10AS027E3F29I2SG Information
10AS027E3F29I2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AS027E3F29I2SG
10AS027E3F29I2SG CAD Models
10AS027E3F29I2SG Part Data Attributes
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10AS027E3F29I2SG
Intel Corporation
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Datasheet
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10AS027E3F29I2SG
Intel Corporation
Field Programmable Gate Array, 270000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
10AS027E3F29I2SG Frequently Asked Questions (FAQ)
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The 10AS027E3F29I2SG FPGA has an operating temperature range of 0°C to 100°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
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Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
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Intel provides guidelines for PCB layout and routing in the '10AS027E3F29I2SG FPGA Development Kit User Guide'. Key recommendations include using a 4-layer PCB, separating analog and digital signals, and minimizing signal trace lengths.
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To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power management features, such as the Power Manager IP core.
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Intel recommends using 0.01 μF to 0.1 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, with a maximum distance of 1 inch (2.54 cm).