Part Details for 10AX066N3F40I2SG by Intel Corporation
Results Overview of 10AX066N3F40I2SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Communication and Networking
10AX066N3F40I2SG Information
10AX066N3F40I2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX066N3F40I2SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC FPGA 588 I/O 1517FBGA / Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA | 100 |
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$1,179.7500 | Buy Now |
Part Details for 10AX066N3F40I2SG
10AX066N3F40I2SG CAD Models
10AX066N3F40I2SG Part Data Attributes
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10AX066N3F40I2SG
Intel Corporation
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Datasheet
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10AX066N3F40I2SG
Intel Corporation
Field Programmable Gate Array, 660000-Cell, CMOS, PBGA1517, 40 X 40 MM, ROHS COMPLIANT, FBGA-1517
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B1517 | |
| Length | 40 mm | |
| Number of CLBs | 25168 | |
| Number of Inputs | 588 | |
| Number of Logic Cells | 660000 | |
| Number of Outputs | 588 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 25168 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 40 mm |
10AX066N3F40I2SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX066N3F40I2SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.
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Intel recommends using a clocking scheme that includes a clock manager, such as the Intel FPGA Clock Manager, to ensure reliable clock distribution and minimize skew.
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To optimize power consumption, use Intel's PowerPlay power analysis tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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To ensure signal integrity, use Intel's Signal Integrity Tool to analyze and optimize signal routing, and follow best practices for signal routing, such as using differential signaling and minimizing signal length.
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The maximum operating temperature of the 10AX066N3F40I2SG FPGA is 100°C, but it is recommended to operate the device at a temperature below 85°C for optimal performance and reliability.